Method of manufacturing organic light emitting display

ABSTRACT

A method of manufacturing an organic light emitting display includes forming a first light-emitting layer on a substrate, forming a first portion of a second light-emitting layer on the first light-emitting layer, forming a third light-emitting layer on the first light-emitting layer, and forming a second portion of the second light-emitting layer on the first portion of the second light-emitting layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of Korean PatentApplication No. 10-2013-0016912, filed on Feb. 18, 2013, in the KoreanIntellectual Property Office, the entire content of which isincorporated herein by reference.

BACKGROUND

1. Field

Embodiments of the present invention relate to a method of manufacturingan organic light emitting display.

2. Description of the Related Art

An organic light emitting diode (OLED) emits light due to a differencein energy that occurs when holes injected through an anode electrode andelectrons injected through a cathode electrode are re-combined with eachother in a light-emitting layer. The emitted light may have differentwavelengths, for example, red, green, and blue wavelengths, according tothe properties of the light-emitting layer. The wavelength of theemitted light may be determined by a material (an organic matterincluding a host material and a dopant material) of the light-emittinglayer.

The light-emitting layer may be formed by evaporating or depositing thematerial, or by performing transcription (e.g., the act of transcribing)using a donor film.

When the light-emitting layer is transcribed using the donor film, thelight-emitting layer may be defectively transcribed depending on adegree of flatness of a surface of a substrate (e.g., a surface of asubstrate that is not perfectly flat), or may be defectively transcribeddue to an energy of a surface of the donor film, or may be transcribedto an undesired region.

SUMMARY

Accordingly, embodiments of the present invention provide a method ofmanufacturing an organic light emitting display capable of reducing orpreventing a defect of a light-emitting layer.

Embodiments of the present invention also provide a method ofmanufacturing an organic light emitting display in which alight-emitting layer may be well transcribed to a desired region.

To achieve the foregoing and/or other aspects of embodiments of thepresent invention, according to an embodiment of the present invention,there is provided a method of manufacturing an organic light emittingdisplay, the method including forming a first light-emitting layer on asubstrate, forming a first portion of a second light-emitting layer onthe first light-emitting layer, forming a third light-emitting layer onthe first light-emitting layer, and forming a second portion of thesecond light-emitting layer on the first portion of the secondlight-emitting layer.

The first light-emitting layer may be formed in a first sub-pixelregion, a second sub-pixel region, and a third sub-pixel region.

The second light-emitting layer may be formed in the first sub-pixelregion, and the third light-emitting layer may be formed in the secondsub-pixel region.

The second light-emitting layer may be thicker than the thirdlight-emitting layer.

The first light-emitting layer may be a blue light-emitting layer, thesecond light-emitting layer may be a red light-emitting layer, and thethird light-emitting layer may be a green light-emitting layer.

The first portion of the second light-emitting layer may include anintermediate layer and an auxiliary layer, and the second portion of thesecond light-emitting layer may include an organic layer.

Forming the first portion of the second light-emitting layer may includeplacing a donor film, which includes the auxiliary layer and theintermediate layer laminated on a base member, close to the firstlight-emitting layer, and irradiating the donor film to transcribe theauxiliary layer and the intermediate layer to the first light-emittinglayer.

Forming the second portion of the second light-emitting layer mayinclude placing a donor film, which includes the organic layer on a basemember, close to the first portion of the second light-emitting layer,and irradiating the donor film to transcribe the organic light-emittinglayer to the auxiliary layer.

The third light-emitting layer may include an intermediate layer, anauxiliary layer, and an organic layer.

Forming the third light-emitting layer may include placing a donor film,which includes the organic layer, the auxiliary layer, and theintermediate layer laminated on a base member, close to the firstlight-emitting layer, and irradiating the donor film to transcribe theorganic layer, the auxiliary layer, and the intermediate layer to thefirst light-emitting layer.

According to another embodiment of the present invention, there isprovided a method of manufacturing an organic light emitting display,the method including forming a first light-emitting layer on asubstrate, forming a first portion of a second light-emitting layer onthe first light-emitting layer, forming a first portion of a thirdlight-emitting layer on the first light-emitting layer, forming a secondportion of the second light-emitting layer on the first portion of thesecond light-emitting layer, and forming a second portion of the thirdlight-emitting layer on the first portion of the third light-emittinglayer.

The first light-emitting layer may be formed in a first sub-pixelregion, a second sub-pixel region, and a third sub-pixel.

The second light-emitting layer may be formed in the first sub-pixelregion, and the third light-emitting layer may be formed in the secondsub-pixel region.

The first light-emitting layer may be a blue light-emitting layer, thesecond light-emitting layer may be a red light-emitting layer, and thethird light-emitting layer may be a green light-emitting layer.

The first portion of the second light-emitting layer may include anintermediate layer and an auxiliary layer, and the second portion of thesecond light-emitting layer may include an organic layer.

Forming the first portion of the second light-emitting layer may includeplacing a donor film, which includes the auxiliary layer and theintermediate layer laminated on a base member, close to the firstlight-emitting layer, and irradiating the donor film to transcribe theauxiliary layer and the intermediate layer to the first light-emittinglayer.

Forming the second portion of the second light-emitting layer mayinclude placing a donor film, which includes the organic layer on a basemember, close to the first portion of the second light-emitting layer,and irradiating the donor film to transcribe the organic light-emittinglayer to the auxiliary layer.

The first portion of the third light-emitting layer may include anintermediate layer and an auxiliary layer, and the second portion of thethird light-emitting layer may include an organic layer.

Forming the first portion of the third light-emitting layer may includeplacing a donor film, which includes the auxiliary layer and theintermediate layer laminated on a base member, close to the firstlight-emitting layer, and irradiating the donor film to transcribe theauxiliary layer and the intermediate layer to the first light-emittinglayer.

Forming the second portion of the third light-emitting layer may includeplacing a donor film, which includes the organic layer on a base member,close to the first portion of the third light-emitting layer, andirradiating the donor film to transcribe the organic layer to theauxiliary layer.

According to still another embodiment, there is provided a method ofmanufacturing an organic light emitting display, the method includingforming a first light-emitting layer in a first sub-pixel region, asecond sub-pixel region, and a third sub-pixel region of a substrate,forming a first portion of a second light-emitting layer and a firstportion of a third light-emitting layer respectively on the firstlight-emitting layer at the first sub-pixel region and on the firstlight-emitting layer at the second sub-pixel region, forming a secondportion of the second light-emitting layer on the first portion ofsecond light-emitting layer, and forming a second portion of the thirdlight-emitting layer on the first portion of the third light-emittinglayer.

The second light-emitting layer may be thicker than the thirdlight-emitting layer.

The first light-emitting layer may be a blue light-emitting layer, thesecond light-emitting layer may be a red light-emitting layer, and thethird light-emitting layer may be a green light-emitting layer.

Each of the first portion of the second light-emitting layer and thefirst portion of the third light-emitting layer may include anintermediate layer and a first auxiliary layer.

Forming the first portion of the second light-emitting layer and thefirst portion of the third light-emitting layer may include placing adonor film, which includes the first auxiliary layer and theintermediate layer laminated on a base member, close to the firstlight-emitting layer, and irradiating the donor film to transcribe thefirst auxiliary layer and the intermediate layer to the firstlight-emitting layer at the first sub-pixel region and the firstlight-emitting layer at the second sub-pixel region.

Forming the second portion of the second light-emitting layer mayinclude placing a donor film, which includes an organic layer and asecond auxiliary layer on a base member, close to the first portion ofthe second light-emitting layer, and irradiating the donor film totranscribe the organic layer and the second auxiliary layer to the firstauxiliary layer at the first sub-pixel region.

The second portion of the third light-emitting layer may include anorganic layer.

Forming the second portion of the third light-emitting layer may includeplacing a donor film, which includes an organic layer on a base member,close to the first portion of the third light-emitting layer, andirradiating the donor film to transcribe the organic layer to a firstauxiliary layer at the second sub-pixel region.

According to embodiments of the present invention, when no less than twolight-emitting layers that emit different light components aresequentially formed on the substrate, one light-emitting layer is formedat least twice. Since the previously formed light-emitting layer of thepartial thickness functions as the spacer, when the other light-emittinglayer is formed, the light-emitting layer does not smear, or is notdefectively formed, and may be correctly formed in a desired region.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, together with the specification, illustrateexemplary embodiments of the present invention, and, together with thedescription, serve to explain aspects of embodiments of the presentinvention, wherein:

FIG. 1 is a sectional view illustrating an organic light emittingdisplay according to an embodiment of the present invention;

FIGS. 2A to 2C are sectional views illustrating a method ofmanufacturing an organic light emitting display according to anembodiment of the present invention;

FIGS. 3A to 3C are sectional views illustrating a method ofmanufacturing an organic light emitting display according to anotherembodiment of the present invention;

FIGS. 4A to 4D are sectional views illustrating a method ofmanufacturing an organic light emitting display according to stillanother embodiment of the present invention; and

FIGS. 5A to 5C are sectional views illustrating a method ofmanufacturing an organic light emitting display according to stillanother embodiment of the present invention.

DETAILED DESCRIPTION

In the following detailed description, only certain exemplaryembodiments of the present invention have been shown and described,simply by way of illustration. As those skilled in the art wouldrealize, the described embodiments may be modified in various differentways, all without departing from the spirit or scope of the presentinvention. Accordingly, the drawings and description are to be regardedas illustrative in nature, and not restrictive. In addition, when anelement is referred to as being “on” another element, it can be directlyon the other element, or can be indirectly on the other element with oneor more intervening elements interposed therebetween. Also, when anelement is referred to as being “connected to” another element, it canbe directly connected to the other element, or it can be indirectlyconnected to the other element with one or more intervening elementsinterposed therebetween. Hereinafter, like reference numerals refer tolike elements.

Hereinafter, embodiments of the present invention will be described morefully with reference to the accompanying drawings, in which exemplaryembodiments of the invention are shown. The described embodiments may,however, be embodied in many different forms, and should not beconstrued as being limited to the embodiments set forth herein; ratherthese embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the concept of embodiments of thepresent invention to those skilled in the art.

FIG. 1 is a sectional view illustrating an organic light emittingdisplay according to an embodiment of the present invention. An organiclight emitting display according to the present embodiment includes asubstrate including a display region, in which an image is displayed,and a non-display region around the display region, a plurality ofpixels formed in the display region of the substrate, and anencapsulation unit for sealing the plurality of pixels.

Each of the plurality of pixels includes a plurality of sub-pixels, forexample, a red sub-pixel, a green sub-pixel, a blue sub-pixel, and awhite sub-pixel. Each of the sub-pixels may be formed of an organiclight emitting diode (OLED), which includes an anode electrode, acathode electrode, and a light-emitting layer located between the anodeelectrode and the cathode electrode. A hole injecting layer and a holetransport layer may be interposed between the anode electrode and thelight-emitting layer. An electron transport layer and an electroninjecting layer may be interposed between the light-emitting layer andthe cathode electrode.

FIG. 1 illustrates a part of a display region in which an image isdisplayed. Regions respectively corresponding to ones of a plurality ofsub-pixels that form a pixel, for example, a first sub-pixel region SP1,a second sub-pixel region SP2, and a third sub-pixel SP3 region, areillustrated.

Referring to FIG. 1, a first electrode 12 is formed in each of the firstsub-pixel region SP1, the second sub-pixel region SP2, and the thirdsub-pixel region SP3 of a substrate 10. Further, a hole injecting layer14 and a hole transport layer 16 are formed on the substrate 10 and thefirst electrode 12. The hole injecting layer 14 or the hole transportlayer 16 may be omitted, or may be formed of a plurality of layers.

A first light-emitting layer 20 is formed on the hole transport layer16. In FIG. 1, the first light-emitting layer 20 is commonly formed inthe first sub-pixel region SP1, the second sub-pixel region SP2, and thethird sub-pixel region SP3. However, in other embodiments of the presentinvention, the first light-emitting layer 20 may be selectively formedonly in a single region.

A second light-emitting layer 30 is formed on the first light-emittinglayer 20 in/at the first sub-pixel region SP1, and a thirdlight-emitting layer 40 is formed on the first light-emitting layer 20in/at the second sub-pixel region SP2.

An electron transport layer 52 and an electron injecting layer 54 areformed on the first light-emitting layer 20, the second light-emittinglayer 30, and the third light-emitting layer 40. A second electrode 56is formed on the electron injecting layer 54. In other embodiments ofthe present invention, the electron transport layer 52 or the electroninjecting layer 54 may be omitted, or may be formed of a plurality oflayers.

The above-described organic light emitting display may be manufacturedas described below.

The organic light emitting display according to the present embodimentof the present invention may be manufactured by methods disclosed inKorean Patent Publications Nos. 10-2013-0007307 and 10-2013-0007308(both published on Jan. 18, 2013) invented by the applicant/inventor ofthe present invention. However, the embodiments of the present inventionare not limited to the above disclosed methods, and well-known variousembodiments may be applied.

FIGS. 2A to 2C are sectional views illustrating a method ofmanufacturing an organic light emitting display according to anembodiment of the present invention.

Referring to FIG. 1, the first electrode 12, which is formed as an anodeelectrode, is formed in each of the first sub-pixel region SP1, thesecond sub-pixel region SP2, and the third sub-pixel region SP3 of thesubstrate 10, and the hole injecting layer 14 and the hole transportlayer 16 are formed on the substrate 10 and the first electrode 12.

In the present embodiment, which is described hereinafter, manufacturingprocesses will be omitted, and processes of forming the firstlight-emitting layer 20, the second light-emitting layer 30, and thethird light-emitting layer 40 on the substrate 10 will be mainlydescribed.

Referring to FIG. 2A, the first light-emitting layer 20 is formed in thefirst sub-pixel region SP1, the second sub-pixel region SP2, and thethird sub-pixel region SP3 of the substrate 10, and a secondlight-emitting layer 30 a of a partial thickness (e.g., a first portion30 a of the second light-emitting layer 30) is formed on the firstlight-emitting layer 20 in the first sub-pixel region SP1. The partialthickness may correspond to 30% to 70% of an entire thickness of thesecond light-emitting layer 30.

For example, when a donor film 62 (in which the second light-emittinglayer 30 a of the partial thickness is formed on a base member 60) iskept close to the first light-emitting layer 20, and when light, heat,or laser is irradiated to the donor film 62 at the first sub-pixelregion SP1, the second light-emitting layer 30 a of the partialthickness may be transcribed to the first light-emitting layer 20 at thefirst sub-pixel region SP1.

Referring to FIG. 2B, the third light-emitting layer 40 is formed on thefirst light-emitting layer 20 at the second sub-pixel region SP2.

For example, when a donor film 72 (in which the third light-emittinglayer 40 is formed on a base member 70) is place/kept close to the firstlight-emitting layer 20, and when laser is irradiated to the donor film72 corresponding to the second sub-pixel region SP2, the thirdlight-emitting layer 40 may be transcribed to the first light-emittinglayer 20 in the second sub-pixel region SP2.

Referring to FIG. 2C, a second light-emitting layer 30 b of a remainingthickness (e.g., a second portion 30 b of the second light-emittinglayer 30) is formed on the first portion 30 a the second light-emittinglayer 30.

For example, when a donor film 82 (in which the second portion 30 b ofthe second light-emitting layer 30, also referred to as the secondlight-emitting layer 30 b of additional/remaining thickness, is formedon a base member 80) is placed and kept close to the secondlight-emitting layer 30 a of the partial thickness on the firstlight-emitting layer 20, and when laser is irradiated to the donor film82 corresponding to the first sub-pixel region SP1, the secondlight-emitting layer 30 b of the remaining thickness may be transcribedon the second light-emitting layer 30 a of the partial thickness.

In the above embodiment, the second light-emitting layer 30 is formedtwice (e.g., is formed in two stages, or by two processes). However, inother embodiments of the present invention, the third light-emittinglayer 40 may be formed twice, and the second light-emitting layer 30 maybe formed by a single process.

In other embodiments, when the second light-emitting layer 30 of theentire thickness (e.g., the entire second light-emitting layer 30) isinstead formed by a single process, although laser is irradiated only tothe donor film 62 corresponding to the first sub-pixel region SP1, thesecond sub-pixel region SP2 or the third sub-pixel region SP3 adjacentto the first sub-pixel region SP1 may be smeared with a portion of thesecond light-emitting layer 30.

When a surface of the substrate 10 is not flat, or when energy of asurface of the donor film 62 is high, the second light-emitting layer 30may be transcribed to the second sub-pixel region SP2 or to the thirdsub-pixel region SP3 around the first sub-pixel region SP1. When thesecond light-emitting layer 30 is transcribed to the second sub-pixelregion SP2 or the third sub-pixel region SP3, because the firstlight-emitting layer 20 and the second light-emitting layer 30 overlapin the second and third sub-pixel regions SP2 and SP3, a defect such asa surface spot is caused. Furthermore, a defect caused by the firstlytranscribed second light-emitting layer 30 may be larger than (e.g., hasa greater deleterious effect than) a defect caused by the secondlytranscribed third light-emitting layer 40.

In the present embodiment of the present invention, to reduce or preventthe above-described defect, the firstly transcribed secondlight-emitting layer 30 is formed at least twice (e.g., is formed by atleast two separate processes). Since the previously formed secondlight-emitting layer 30 a of the partial thickness functions as aspacer, the third light-emitting layer 40 may be correctly formed in thesecond sub-pixel region SP2. That is, because the third light-emittinglayer 40 previously contacts the second light-emitting layer 30 a havinga relatively large step difference to be transcribed to the secondsub-pixel region SP2, the third light-emitting layer 40 may be correctlytranscribed without smearing to the second sub-pixel region SP2.

FIGS. 3A to 3C are sectional views illustrating a method ofmanufacturing an organic light emitting display according to anotherembodiment of the present invention.

In the embodiment of FIGS. 2A to 2C, the first, second, and thirdlight-emitting layers 20, 30, and 40 are formed of materials that mayemit visible rays of light of specific colors. In the presentembodiment, each of the second and third light-emitting layers 30 and 40includes an intermediate layer, an auxiliary layer, and an organiclayer. The intermediate layers are formed to improve a transportefficiency of holes. The auxiliary layers are formed to control opticalthicknesses (resonance distances) of the light-emitting layers so that amicro-cavity effect may be realized. The organic layers are formed ofmaterials that may emit visible rays of light of specific colors.

Referring to FIG. 3A, the first light-emitting layer 20 is formed in thefirst sub-pixel region SP1, the second sub-pixel region SP2, and thethird sub-pixel region SP3 of the substrate, and the secondlight-emitting layer 30 a of the partial thickness (e.g., a firstportion 30 a of the second light-emitting layer 30) is formed on thefirst light-emitting layer 20 in the first sub-pixel region SP1. Thesecond light-emitting layer 30 a of the partial thickness may include anintermediate layer 32 and an auxiliary layer 34.

For example, when the donor film 62 (in which the auxiliary layer 34 andthe intermediate layer 32 are laminated on the base member 60) is keptclose to the first light-emitting layer 20, and when a laser isirradiated to the donor film 62 corresponding to the first sub-pixelregion SP1, the auxiliary layer 34 and the intermediate layer 32 may betranscribed to the first light-emitting layer 20 at the first sub-pixelregion SP1.

Referring to FIG. 3B, the third light-emitting layer 40 is formed on thefirst light-emitting layer 20 at the second sub-pixel region SP2. Thethird light-emitting layer 40 may include an intermediate layer 42, anauxiliary layer 44, and an organic layer 46.

For example, when the donor film 72 (in which the organic layer 46, theauxiliary layer 44, and the intermediate layer 42 are laminated on thebase member 70) is kept close to the second light-emitting layer 30 a onthe first light-emitting layer 20, and when a laser is irradiated to thedonor film 72 corresponding to the second sub-pixel region SP2, theorganic layer 46, the auxiliary layer 44, and the intermediate layer 42may be transcribed to the first light-emitting layer 20 at the secondsub-pixel region SP2.

Referring to FIG. 3C, the second light-emitting layer 30 b ofadditional/remaining thickness (e.g., a second/remaining portion 30 b ofthe second light-emitting layer 30) is formed on the secondlight-emitting layer 30 a of the partial thickness. The secondlight-emitting layer 30 b of the remaining thickness may include anorganic layer.

For example, when the donor film 82 (in which the organic layer 30 b isformed on the base member 80) is kept close to the second light-emittinglayer 30 a on the first light-emitting layer 20, and when laser isirradiated to the donor film 82 corresponding to the first sub-pixelregion SP1, the organic layer 30 b may be transcribed to the auxiliarylayer 34.

In the above embodiment, the firstly transcribed second light-emittinglayer 30 is formed at least twice (e.g., is formed using at least twoprocesses) so that the second light-emitting layer 30 a of the partialthickness includes additional functional layers, for example, theintermediate layer 32 and the auxiliary layer 34, while the secondlight-emitting layer 30 b of the remaining thickness includes theorganic layer.

Since the previously formed second light-emitting layer 30 a of thepartial thickness functions as a spacer, the third light-emitting layer40 may be correctly formed only in a desired region, for example, thesecond sub-pixel region SP2.

In the above embodiment, the second light-emitting layer 30 is formedtwice/is formed in two stages. However, in other embodiments of thepresent invention, the third light-emitting layer 40 may be formedtwice, and the second light-emitting layer 30 may be formed by oneprocess.

FIGS. 4A to 4D are sectional views illustrating a method ofmanufacturing an organic light emitting display according to stillanother embodiment of the present invention.

In the embodiments described above, only one of the secondlight-emitting layer 30 or the third light-emitting layer 40 is formedby two processes. However, in the present embodiment, the secondlight-emitting layer 30 and the third light-emitting layer 40 are bothformed by two processes. Each of the second and third light-emittinglayers 30 and 40 includes an intermediate layer, an auxiliary layer, andan organic layer.

The intermediate layers (e.g., 32 and 42) are formed to improvetransport efficiency of holes. The auxiliary layers (e.g., 34 and 44)are formed to control optical thicknesses (resonance distances) of thelight-emitting layers so that micro-cavity effect may be realized. Theorganic layers are formed of materials that may emit visible rays ofspecific colors.

Referring to FIG. 4A, the first light-emitting layer 20 is formed in thefirst sub-pixel region SP1, the second sub-pixel region SP2, and thethird sub-pixel region SP3 of the substrate and the secondlight-emitting layer 30 a of the partial thickness is formed on thefirst light-emitting layer 20 of the first sub-pixel region SP1. Thesecond light-emitting layer 30 a of the partial thickness may includethe intermediate layer 32 and the auxiliary layer 34.

For example, when the donor film 62 (in which the auxiliary layer 34 andthe intermediate layer 32 are laminated on the base member 60) is keptclose to the first light-emitting layer 20, and when laser is irradiatedto the donor film 62 corresponding to the first sub-pixel region SP1,the auxiliary layer 34 and the intermediate layer 32 may be transcribedto the first light-emitting layer 20 of the first sub-pixel region SP1.

Referring to FIG. 4B, a third light-emitting layer 40 a of a partialthickness (e.g., a first portion 40 a of the third light-emitting layer40) is formed on the first light-emitting layer 20 at the secondsub-pixel region SP2. The third light-emitting layer 40 a of the partialthickness may include the intermediate layer 42, the auxiliary layer 44,and the organic layer 46.

For example, when the donor film 72 (in which the auxiliary layer 44 andthe intermediate layer 42 are laminated on the base member 70) is keptclose to the first light-emitting layer 20, and when laser is irradiatedto the donor film 72 corresponding to the second sub-pixel region SP2,the auxiliary layer 44 and the intermediate layer 42 may be transcribedto the first light-emitting layer 20 of the second sub-pixel region SP2.

Referring to FIG. 4C, the second light-emitting layer 30 b of theremaining thickness is formed on the second light-emitting layer 30 a inthe first sub-pixel region SP1. The second light-emitting layer 30 b ofthe remaining thickness may include the organic layer.

For example, when the donor film 82 (in which the organic layer 30 b isformed on the base member 80) is kept close to the second light-emittinglayer 30 a on the first light-emitting layer 20, and when laser isirradiated to the donor film 82 corresponding to the first sub-pixelregion SP1, the organic layer 30 b may be transcribed to the auxiliarylayer 34.

Referring to FIG. 4D, a third light-emitting layer 40 b of anadditional/remaining thickness (e.g., a second portion 40 b of the thirdlight-emitting layer 40) is formed on the third light-emitting layer 40a of the second sub-pixel region SP2. The third light-emitting layer 40b of the remaining thickness may include the organic layer.

For example, when a donor film 92 (in which the organic layer 40 b isformed on a base member 90) is kept close to the third light-emittinglayer 40 a on the first light-emitting layer 20, and when a laser isirradiated to the donor film 92 corresponding to the second sub-pixelregion SP2, the organic layer 40 b may be transcribed to the auxiliarylayer 44.

In the above embodiment, the firstly transcribed second light-emittinglayer 30 and the secondly transcribed third light-emitting layer 40 areformed using two different processes (e.g., are each formed using twoprocesses, or using four processes in total).

Because the previously formed second light-emitting layer 30 a of thepartial thickness and the third light-emitting layer 40 a of the partialthickness function as spacers, the second light-emitting layer 30 andthe third light-emitting layer 40 may be correctly formed in a desiredregion.

FIGS. 5A to 5C are sectional views illustrating a method ofmanufacturing an organic light emitting display according to stillanother embodiment of the present invention.

In the present embodiment, like in the embodiment of FIGS. 4A to 4D, thesecond light-emitting layer 30 and the third light-emitting layer 40 areformed by two separate processes. Further, the second light-emittinglayer 30 a of the partial thickness and the third light-emitting layer40 a of the partial thickness are formed during the same process. Thepresent embodiment may be effectively applied when the secondlight-emitting layer 30 and the third light-emitting layer 40 includethe same material.

Referring to FIG. 5A, the first light-emitting layer 20 is formed in thefirst sub-pixel region SP1, the second sub-pixel region SP2, and thethird sub-pixel region SP3 of the substrate 10, and the secondlight-emitting layer 30 a of the partial thickness and the thirdlight-emitting layer 40 a of the partial thickness are respectivelyformed on the first light-emitting layer 20 at the first sub-pixelregion SP1 and at the second sub-pixel region SP2. Each of the secondlight-emitting layer 30 a of the partial thickness and the thirdlight-emitting layer 40 a of the partial thickness may include theintermediate layer 32 and a first auxiliary layer 34. That is, theintermediate layer 32 and the first auxiliary layer 34 may be commonlyformed in the first sub-pixel region SP1 and the second sub-pixel regionSP2, and may be formed of the same material.

For example, when the donor film 62 (in which the first auxiliary layer34 and the intermediate layer 32 are laminated on the base member 60) iskept close to the first light-emitting layer 20, and when laser isirradiated to the donor film 62 corresponding to the first sub-pixelregion SP1 and the second sub-pixel region SP2, the first auxiliarylayer 34 and the intermediate layer 32 may be transcribed to the firstlight-emitting layer 20 at the first sub-pixel region SP1 and at thesecond sub-pixel region SP2.

Referring to FIG. 5B, the second light-emitting layer 30 b of theremaining thickness is formed on the second light-emitting layer 30 a atthe first sub-pixel region SP1. The second light-emitting layer 30 b ofthe remaining thickness of the present embodiment may include a secondauxiliary layer 36 and an organic layer 38.

For example, when the donor film 72 (in which the organic layer 38 andthe second auxiliary layer 36 are formed on the base member 70) is keptclose to the second light-emitting layer 30 a on the firstlight-emitting layer 20, when and laser is irradiated to the donor film72 corresponding to the first sub-pixel region SP1, the organic layer 38and the second auxiliary layer 36 may be transcribed to the firstauxiliary layer 34 of the first sub-pixel region SP1.

Referring to FIG. 5C, the third light-emitting layer 40 b of theremaining thickness is formed on the third light-emitting layer 40 a ofthe second sub-pixel region SP2. The third light-emitting layer 40 b ofthe remaining thickness of the present embodiment may include theorganic layer.

For example, when the donor film 82 in which the organic layer 40 b isformed on the base member 80 is kept close to the third light-emittinglayer 40 a on the first light-emitting layer 20, and when laser isirradiated to the donor film 82 corresponding to the second sub-pixelregion SP2, the organic layer 40 b may be transcribed to the firstauxiliary layer 34 at the second sub-pixel region SP2.

In the above embodiments, one of the light-emitting layers formed in twoprocesses may be a relatively, or comparatively, thick light-emittinglayer. For example, the second light-emitting layer 30 is thicker thanthe third light-emitting layer 40.

In the above embodiments, the first light-emitting layer 20 may be ablue light-emitting layer, the second light-emitting layer 30 may be ared light-emitting layer, and the third light-emitting layer 40 may be agreen light-emitting layer. Alternatively, the first light-emittinglayer 20 may be a blue light-emitting layer, the second light-emittinglayer 30 may be a green light-emitting layer, and the thirdlight-emitting layer 40 may be a red light-emitting layer.

Although not described in the above embodiments, referring to FIG. 1,the electron transport layer 52 and the electron injecting layer 54 areformed on the first light-emitting layer 20, the second light-emittinglayer 30, and the third light-emitting layer 40, and the secondelectrode 56 as the cathode electrode is formed on the electroninjecting layer 54.

While embodiments of the present invention have been described inconnection with certain exemplary embodiments, it is to be understoodthat the invention is not limited to the disclosed embodiments, but, onthe contrary, is intended to cover various modifications and equivalentarrangements included within the spirit and scope of the appendedclaims, and equivalents thereof.

What is claimed is:
 1. A method of manufacturing an organic lightemitting display, the method comprising: forming a first light-emittinglayer on a substrate including a first sub-pixel region, a secondsub-pixel region, and a third sub-pixel region; forming a first portionof a second light-emitting layer on the first light-emitting layer inthe first sub-pixel region; forming a third light-emitting layerdirectly on the first light-emitting layer in the second sub-pixelregion after the forming of the first portion of the secondlight-emitting layer; and forming a second portion of the secondlight-emitting layer on the first portion of the second light-emittinglayer in the first sub-pixel region after the forming of the thirdlight-emitting layer.
 2. The method as claimed in claim 1, wherein thesecond light-emitting layer is thicker than the third light-emittinglayer.
 3. The method as claimed in claim 1, wherein the firstlight-emitting layer is a blue light-emitting layer, wherein the secondlight-emitting layer is a red light-emitting layer, and wherein thethird light-emitting layer is a green light-emitting layer.
 4. Themethod as claimed in claim 1, wherein the first portion of the secondlight-emitting layer comprises an intermediate layer and an auxiliarylayer, and wherein the second portion of the second light-emitting layercomprises an organic layer.
 5. The method as claimed in claim 4, whereinforming the first portion of the second light-emitting layer comprises:placing a donor film, which comprises the auxiliary layer and theintermediate layer laminated on a base member, close to the firstlight-emitting layer; and irradiating the donor film to transcribe theauxiliary layer and the intermediate layer to the first light-emittinglayer.
 6. The method as claimed in claim 4, wherein forming the secondportion of the second light-emitting layer comprises: placing a donorfilm, which comprises the organic layer on a base member, close to thefirst portion of the second light-emitting layer; and irradiating thedonor film to transcribe the organic layer to the auxiliary layer. 7.The method as claimed in claim 1, wherein the third light-emitting layercomprises an intermediate layer, an auxiliary layer, and an organiclayer.
 8. The method as claimed in claim 7, wherein forming the thirdlight-emitting layer comprises: placing a donor film, which comprisesthe organic layer, the auxiliary layer, and the intermediate layerlaminated on a base member, close to the first light-emitting layer; andirradiating the donor film to transcribe the organic layer, theauxiliary layer, and the intermediate layer to the first light-emittinglayer.